Semiconductor
CMP Pad Conditioner
- Designed to work on all processes (Oxide, W, Cu) and with all CMP tools (AMAT, Ebara, Novellus, etc.)
- Conditioners are manufactured with world-class quality controls
- Diamond size, placement, and orientation are controlled to maximize the performance in each different application
- Available with either brazed or electroplated technology
CVD CMP Pad Conditioner
- Consistent pad cut rate and wafer polishing rate over the life of the conditioner
- Chemically inert (no metal contamination)
- Low-cost of consumables (disc & pad) and high throughput through reduced PM time
- Designed to allow for varying pad debris sizes
Back Grinding Wheel
1. Rough Grinding (Z1)
a. Vitrified Bond (#400~800)
i. Low and consistent grinding current and longer wheel life time
b. Resin Bond (#325~600)
i. Less edge chipping and grinding damage on thin wafer
ii. Excellent grinding ability without compromising wheel life time
2. Fine Grinding (Z2)
a. Resin Bond (#2000~4000)
i. Easy grinding with lower machine current requirements
ii. Considerably longer tool life than competitors’
iii. #3000~4000: Superior surface roughness and minimized sawing mark
Dicing Wheel
- Hub Type
- Reduced Chipping
- High-precision bevel profile
- Highly durable bevel profile resulting in longer blade life time
Applications
- Si wafer, LT/LN wafer, glass wafer, ceramics, etc.
Micro Wheel
- Hubless type
- High precision blade with superior cutting efficiency
- Allowing for superior cutting quality at high RPM and fast feed rates
- Minimized chipping during the sawing operation
Applications
- Sawing for a wide range of package type including QFN, FBGA, CSP, MCP, etc.
- Sawing and grooving for ferrite, ceramics, glass, quartz, sapphire, etc.
Publications
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