LED & Display

High precision diamond tools are used in semiconductor IC(Integrated Circuit), Display, LED, and Solar Cell manufacturing industry. Based on its own advanced technology and technical exchange with market leading companies, EHWA is developing the best quality products and contributing to the development of future growth industry such as smart devices, LED/SOLAR.

Publications

Technical Info

PDW

High throughput and superior cutting quality
Reduced process lead time and kerf loss
Improved flatness of cuts with less warping and TTV
Allowing for thin wafer slicing through uniform diamond grit
Longer wire life (excellent diamond retention & no wire breakage)
Faster cutting speed (3~10 times compared with slurry process)
Low COO and Eco-friendly (slurry-free process)

Applications

Cropping: mono silicon ingot, sapphire ingot
Squaring: mono silicon ingot, poly silicon jumbo ingot
Slicing: mono/poly silicon ingot wafer, sapphire wafer, silicon carbide(siC) wafer

CVD CMP Pad Conditioner

Consistent product quality through automatic manufacturing system
Excellent glass edge strength (minimized edge crack)
A wide range of applications

Product Types

CGC: Optimized solution for brittle materials
NGC: Improved scribing efficiency by creating deep vertical cracks on work piece
HPES: Superior glass edge strength

Edge Polishing Wheel

Higher removal rate than competitors’ wheels (high throughput)
Superior surface finish (stronger edge strength)
Longer tool life (low cost of consumables and reduced wheel change time)

Electroplated Wheel

Minimized product to product variation through stringent diamond grit distribution control
Superior cutting quality through optimized configuration of diamond grit size and concentration
50% longer wheel life time compared to competitors’ wheels

Applications